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Copper
Copper
ACID COPPER – Sulfuric acid-based copper plating processes quickly and efficiently produce low-stressed, ductile, bright copper deposits. The additives are designed to operate at bath temperatures of 75 – 100o F (24 – 38o C) without any noticeable loss in quality. This allows for faster deposition rates with fewer defects.
The outstanding features of bright acid copper processes are:
• Fast plating rates at higher current density with lower burn
• High deposit brightness, exceptional rates of brightening and leveling, and no loss of ductility
• Ease of bath maintenance and control under production conditions
• Replenishment based on ampere-hours and controlled by Hull Cell tests.
• Wide operating temperature range
ALKALINE NON-CYANIDE COPPER – This process is engineered for use on all commonly used metal base materials, including zinc die-cast. The process exhibits exceptional throwing power and adhesion on complex part geometries. It produces a semi-bright copper deposit that is suitable either as a strike or main copper layer for nickel and chromium plating
PYROPHOSPHATE COPPER PLATING – This process can be used in place of cyanide or acid copper in a wide variety of functional and decorative applications including electroforming and plating on properly prepared zinc-based die-castings and aluminum.
Advantages of the process are:
• Fully bright deposits over a wide range of current densities
• Good leveling properties
• Excellent throwing power
• Non-corrosive to parts and equipment
• Simple make-up, using liquid concentrates
• Easy to control brightener system
• Does not produce immersion deposits on steel parts
CYANIDE COPPER – Cyanide copper plating processes offer ease of control and bright, ductile and economical leveling properties over a wide range of current densities and plate thicknesses. Advantages are:
• Particularly suited for deposits over zinc base die-castings
• Deposits have excellent buffability properties.
• May be used with direct current or for higher deposition rates with interrupted current or periodic reverse
IMMERSION COPPER- processes provide a uniform deposit with exceptional adhesion. The process allows for subsequent acid copper treatment without the need for a nickel strike and helps to plate large and complicated shaped plastic parts. Based on the application,
Please contact us with your requirements and we will provide pricing and / or additional information.
