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Printed Circuit Board Tapes
Printed Circuit Board Tapes
Clear – Acrylic Adhesive
2.4 mil total. 1 mil polyester film with 1.4 mils of electrical grade
acrylic adhesive. Excellent resistance to solvents, heat and
chemicals. Used for component packaging & electrical insulation,
edge reinforcement on books, webs, etc. Exhibits high resistance
to abrasives, acids, oils, aging, staining and water immersion.
Meets UL510 Class B (130ºC / 266ºF). Adhesion to SST: 35 oz/in.
Tensile Strength: 24 lbs/in. Elongation: 100%. Dielectric Strength:
5.5 kV. Max Temperature: 300°F/30min. 3” plastic core.
Clear -Silicone Adhesive
2.5 mil total. 1 mil polyester film with 1.5 mils of electrical grade
silicone adhesive. Designed to be fully stable electrically and
mechanically at operating temperatures up to 350°F. Adhesive
is cured to provide maximum resistance to chemicals and leaves
no residue during masking or holding applications. Excellent
resistance to abrasives, acids, oils, aging, staining, and water
immersion. Used for splicing silicone coated paper and films. Also
used as outer wrap on coils, capacitors, motors, and transformers and for masking in electroplating, anodizing, and PC boards.
Meets UL510 Class B (130ºC / 266ºF). Adhesion to SST: 27 oz/in.
Tensile Strength: 25 lbs/in. Elongation: 100%. Dielectric Strength:
5.5 kV. Temperature Range: -100°F to 350°F. 3” plastic core
Blue – Silicone Adhesive
3.0 mil total. 1 mil polyester film with 2 mils of silicone adhesive.
Resists fumes and chemicals, and leaves minimum residue on
removal. Allows visibility of circuitry after masking. Film will not
break or split during application or removal. A protective tape,
designed to perform well in all phases of masking operations during printed circuit board production. Industry standard plater’s
tape. Protects surfaces from splashes and chemical fumes in tin/
lead stripping and gold tab plating. Adhesion: 30 oz/in. Tensile
Strength: 25 lbs/in. Elongation: 90%. Max Temp. Resistance:
220°C (428°F)/30 min. 3” plastic core.
Red – Silicone Adhesive
3.0 mil total. 1 mil polyester film with 2 mils of silicone adhesive.
Resists fumes and chemicals, and leaves minimum residue on
removal. Allows visibility of circuitry after masking. Film will not
break or split during application or removal. A protective tape
designed to perform well in all phases of masking operations
during printed circuit board production. Engineering grade plating tape. Protects surfaces from splashes and chemical fumes
in tin/lead stripping and gold tab plating. Suitable for painting.
Can be used for splicing of certain silicone coated papers and
films. Meets UL510 Class B (130ºC / 266ºF). Adhesion: 30 oz./in.
Tensile Strength: 24 lbs/in. Elongation: 100%. Dielectric Strength:
5.5 kV. Temperature Range: -100°F to 350°F. 3” plastic core
Emerald Green – Silicone Adhesive
3.5 mil total. 2 mil polyester film coated with a 1.5 mil residue-free
silicone adhesive. High tack and high adhesion. Tear and break
resistant. Its high adhesion and extremely stable adhesive system
give it excellent resistance to corrosive chemicals, suitable for
photo processing chemistry, acids, oils, solvents, aging, water
immersion and staining. One of the cleanest and strongest splicing tapes available. A superior performance leader card splicing
tape. Used for splicing siliconized papers, films and non-woven
materials in converting. Used for masking adhesive seams in
metal bonding processes. Meets UL510 Class B (130ºC / 266ºF).
Adhesion to SST: 35 oz/in. Tensile: 44 lbs/in. Elongation: 110%.
Dielectric Strength: 6.0 kV. Temperature Range: -100ºF to 350ºF.
Max Short Term: 225°C (437°F)/45 min. 3” plastic core.
Dark Blue – Silicone Adhesive
3.5 mil total. 2 mil polyester film coated with a 1.5 mil residue-free
silicone adhesive. It is one of the cleanest and strongest splicing
tapes available with high tack and high adhesion. Good chemical
and heat resistance. Bonds well to treated papers, films, foils,
etc. Used for splicing siliconized papers, films and non-woven
materials in converting. Used for masking adhesive seams in
metal bonding processes. Meets UL510 Class B (130ºC / 266ºF).
Adhesion to SST: 35 oz/in. Tensile: 44 lbs/in. Elongation: 110%.
Dielectric Strength: 6.0 kV. Temperature Range: -100ºF to 350ºF.
3” plastic core.
Brown/Rust – Silicone Adhesive
3.8 mil total. 2 mil polyester film coated with a 1.8 mil residue-free
silicone adhesive. One of the cleanest and strongest splicing tapes
available. Its high adhesion and extremely stable adhesive system
give it excellent resistance to photo processing chemicals, acids,
oils, solvents, aging, staining and water immersion. Superior performance splicing tape used to bond photographic film to leader
card during processing in automated equipment Excellent masking
tape for powder coating applications; used for masking adhesive
seams in metal bonding processes. Used for splicing siliconized
papers, films and non-woven materials in converting. Adhesion
to SST: 42 oz/in. Tensile Strength: 44 lbs/in. Elongation: 100%.
Dielectric Strength: 6.0 kV. Temperature Range: -100ºF to 350ºF.
Max Short Term: 225°C (437°F)/45 min. 3” plastic core.
Pink – Silicone Adhesive
2.5 mil total. 1 mil translucent polyester film with 1.5 mils of
silicone adhesive. Bonds quickly to silicone coated surfaces.
Designed as a more stringent splicing tape for use on all types
of substrates. Used in splicing of silicone treated papers, films
and other substrates. Used for flexible circuit materials during
manufacturing and subsequent processing, and as a protective
maskant on panels subject to mild caustic or acid bath etching
and plating. Adhesion to SST: 33 oz/in. Tensile Strength: 25 lb/
in. Elongation: >90%. Max Temp. Resistance: 220°C (428°F)/30
min. 3” plastic core
Please contact us with your requirements and we will provide pricing and / or additional information.
